Cita APA (7a ed.)
Lee, T., & et al. (2015). Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer.
Cita Chicago Style (17a ed.)
Lee, Tae-Kyu, y et al. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. New York: Springer, 2015.
Cita MLA (9a ed.)
Lee, Tae-Kyu, y et al. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer, 2015.
Precaución: Estas citas no son 100% exactas.