Style de citation APA (7e éd.)
Lee, T., & et al. (2015). Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer.
Style de citation Chicago (17e éd.)
Lee, Tae-Kyu, et et al. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. New York: Springer, 2015.
Style de citation MLA (9e éd.)
Lee, Tae-Kyu, et et al. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer, 2015.
Attention : ces citations peuvent ne pas être correctes à 100%.