Lee, N. (2002). Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Newnes.
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Citação norma Chicago
Lee, Ning-Cheng. Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Boston: Newnes, 2002.
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Citação norma MLA
Lee, Ning-Cheng. Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Newnes, 2002.
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Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.