(2011). COST Action MP0602: "Advanced Solder Materials for High Temperature Application (HISOLD)". Final Meeting, Brno, Czech Republic, June 22-24, 2011. Masarykova univerzita.
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Chicago Style (17th ed.) Citation
COST Action MP0602: "Advanced Solder Materials for High Temperature Application (HISOLD)". Final Meeting, Brno, Czech Republic, June 22-24, 2011. Brno: Masarykova univerzita, 2011.
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MLA (9th ed.) Citation
COST Action MP0602: "Advanced Solder Materials for High Temperature Application (HISOLD)". Final Meeting, Brno, Czech Republic, June 22-24, 2011. Masarykova univerzita, 2011.
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Warning: These citations may not always be 100% accurate.