Fundamentals of Lead-Free Solder Interconnect Technology : from Microstructures to Reliability /
Uložené v:
| Hlavný autor: | |
|---|---|
| Ďalší autori: | |
| Médium: | Kniha |
| Jazyk: | English |
| Vydavateľské údaje: |
New York
Springer
2015
|
| Predmet: | |
| Tagy: |
Žiadne tagy, Buďte prvý, kto otaguje tento záznam!
|
MARC
| LEADER | 00000nam a22000003a 4500 | ||
|---|---|---|---|
| 001 | 0098763 | ||
| 003 | SK-STU | ||
| 005 | 20221201124640.7 | ||
| 007 | ta | ||
| 008 | 221201s ----xo-----e------000-0-----d | ||
| 020 | |a 978-1-4614-9265-8 | ||
| 040 | |a STU |b slo | ||
| 041 | 0 | |a eng | |
| 044 | |a xxu | ||
| 100 | 1 | |a Lee, Tae-Kyu |4 aut | |
| 245 | 1 | 0 | |a Fundamentals of Lead-Free Solder Interconnect Technology : |b from Microstructures to Reliability / |c aut. Tae-Kyu Lee, et al |
| 260 | |a New York |b Springer |c 2015 | ||
| 300 | |a 253 s. | ||
| 650 | 0 | 7 | |a bezolovnaté spájkovanie |
| 700 | 1 | |a et al. | |
| 996 | |b 284M089182 |c M* 14671-1 |l MMKN |s A |a 24 |w 0098763_0001 | ||